Home >> Industry Knowledge >> Lead-free electronic assembly in regard to the need for nitrogen
    1) in Europe, America and Japan and South Korea to meet customer demands and so on; 
    2) The use of high-temperature solder paste or low-solids, low-activity (no-clean, low-residue) when the solder paste; 
    3) Brazing more expensive integrated circuit components, small size components, fine-pitch components, and can not be flip-chip components, when anti-revisionism; 
    4) too many board assembly processes or brazing coating with OPS reflux several times when the PCB; 
    5) brazing copper pad without protective film or stored for longer periods of time, or reliability of the primary circuit board when.