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Home >> Nitrogen Generator Series >> Nitrogen Generator for SMT
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Nitrogen Generator for SMT
Product Overview
Nitrogen dedicated SMT machines, are company-dimensional nitrogen machine in general use, based on the combination of lead-free soldering SMT industry developed by the technological features of the device-specific support for nitrogen. It's at 99.9% purity in general 99.999% ~ between each welding machine furnace nitrogen flow matching is generally 10 ~ 30Nm3/hr (special specifications according to the actual flow), the dew point is -40 ℃ ~ -60 ℃, nitrogen stress is about 0.5-0.6MPa. SMT-specific nitrogen stable performance, simple operation, easy maintenance and small footprint, good looks, effectively reduces the cost of the majority of users.
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Product advantages
1、Why do you want to import lead-free soldering
Lead is a toxic heavy metal, the body can cause excessive absorption of lead poisoning, low volume of intake may lead to human intelligence, the nervous system and affect the reproductive system. The global electronics assembly industry consumes annually about 60,000 tons around the solder, but also increases every year, resulting lead salt serious industrial waste pollution of the environment, thereby reducing the use of lead has become the focus of attention all over the world. Europe, Japan, Korea and many other large companies are vigorously accelerate the development of lead-free alternative alloys and has been planned in 2002, the assembly of electronic products in the beginning to gradually reduce the use of lead. (Containing elements of traditional solder 63Sn/37Pb, in the current electronics assembly industries, lead was widely used). European Union beginning in 2006 to import lead-free technology, starting July 1 a total ban on leaded electronic products. E-machine industry to develop lead-free technology is an international information industry of the inevitable trend of industrial development, China's Ministry of Information Industry also requested at July 1, 2006, the national implementation of electronic information products, lead-free.
2、Why use lead-free technology into nitrogen
Lead-free reflow equipment on many new requirements, including: a higher heat capacity, under the no-load and load status of the thermal stability of materials suitable for high temperature work, and good thermal insulation, excellent temperature and leak-proof ability of nitrogen, the temperature curve of flexibility, greater cooling capacity. In the process, the use nitrogen atmosphere can be well positioned to meet these requirements, avoid and reduce the products produced in the process of welding defects.
Lead-free electronic assembly in the use of nitrogen for the following needs:
1) in Europe, America and Japan and South Korea to meet customer demands and so on;
2) The use of high-temperature solder paste or low-solids, low-activity (no-clean, low-residue) when the solder paste;
3) Brazing more expensive integrated circuit components, small size components, fine-pitch components, and can not be flip-chip components, when anti-revisionism;
4) too many board assembly processes or brazing coating with OPS reflux several times when the PCB;
5) brazing copper pad without protective film or stored for longer periods of time, or reliability of the primary circuit board when.
2) The use of high-temperature solder paste or low-solids, low-activity (no-clean, low-residue) when the solder paste;
3) Brazing more expensive integrated circuit components, small size components, fine-pitch components, and can not be flip-chip components, when anti-revisionism;
4) too many board assembly processes or brazing coating with OPS reflux several times when the PCB;
5) brazing copper pad without protective film or stored for longer periods of time, or reliability of the primary circuit board when.